Working area: Zhuhai

Work experience: unlimited

Education: Bachelor degree or above

Age requirement: unlimited

Job description:

1. Responsible for cutting-edge technology research and product promotion and release of chip packaging and testing products;

2. Responsible for new product design, new process, new material introduction evaluation;

3. Formulate continuous optimization design and process plans to provide competitive solutions for products;

4. Responsible for the introduction of new product NPI, solve related problems in the process of R&D and mass production, provide engineering design support and quality assurance for product quality failure analysis and life cycle testing;

5. Coordinate semiconductor supply chain resources and solve production abnormalities or technical difficulties in a timely manner.

Qualifications:

1. Master's degree or above, majors in electronic packaging, microelectronics, electronics, semiconductors, etc., outstanding fresh graduates are also welcome;

2. More than 3 years of relevant work experience, familiar with different packaging and testing processes, technologies, materials and key control points such as WLCSP, BGA, QFN/DFN, COB;

3. Strong quality awareness, familiar with SPC, FMEA, DOE, 6 Sigma and other quality tools and ISO9001, IATF16949 and other quality systems;

4. Familiar with MIL, JEDEC and other related packaging standards, familiar with FAE and failure analysis methods.